Substrate loading in microlithography

ABSTRACT

Methods, systems, and apparatus for the loading and unloading of substrates, such as semiconductor wafers, involving microlithography and similar nano-fabrication techniques. The system includes two or more pedestals; a substrate chuck including two or more channels; a turntable having a top surface and a first end positioned opposite a second end, each of the first and second ends including a respective opening, each opening including two or more cutouts and two or more tabs, the turntable rotatable between first and second positions and an actuator system to adjust distances between the turntable and the substrate chuck and between the turntable and the pedestals.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to U.S. Patent Application Ser. No.62/368,443, filed on Jul. 29, 2016, the entire contents of which ishereby incorporated by reference.

TECHNICAL FIELD OF THE INVENTION

This invention relates to the loading of substrates, such assemiconductor wafers, in systems and methods involving microlithographyand similar nano-fabrication techniques.

BACKGROUND OF THE INVENTION

Nano-fabrication includes the fabrication of very small structures thathave features on the order of 100 nanometers or smaller. One applicationin which nano-fabrication has had a sizeable impact is in the processingof integrated circuits. The semiconductor processing industry continuesto strive for larger production yields while increasing the circuits perunit area formed on a substrate, therefore nano-fabrication becomesincreasingly important. Nano-fabrication provides greater processcontrol while allowing continued reduction of the minimum featuredimensions of the structures formed. Other areas of development in whichnano-fabrication has been employed include biotechnology, opticaltechnology, mechanical systems, and the like.

Nano-fabrication can include processing of substrates by exposing thesubstrates to multiple processing modules to form different aspects of amulti-layered structure that includes the substrate, such as etching,photoresist curing, and feature formation. However, transportation ofsubstrates throughout the different modules of a nano-fabrication systemcan affect throughput of the system.

SUMMARY OF THE INVENTION

Innovative aspects of the subject matter described in this specificationmay be embodied in methods that include the actions of providing aturntable comprising a top surface and a first end positioned opposite asecond end, each of the first and second ends including a respectiveopening, each opening including two or more cutouts and two or moretabs; providing a substrate chuck comprising a top surface positionedopposite a bottom surface; positioning the turntable in a first positionsuch that i) the two or more cutouts of the opening of the first end arein superimposition with two or more pedestals and ii) a first end of thetwo or more pedestals extends away from the top surface of theturntable; increasing a distance between the top surface of theturntable and the bottom surface of the substrate chuck to transfer afirst substrate from the two or more pedestals to the two or more tabsof the opening of the first end of the turntable; rotating the turntablefrom the first position to a second position such that i) the two ormore tabs of the opening of the first end of the turntable are insuperimposition with two or more channels of the substrate chuck and ii)the two or more cutouts of the opening of the second end are insuperimposition with the two or more pedestals; and after rotating theturntable from the first position to the second position, decreasing adistance between the top surface of the turntable and the bottom surfaceof the substrate chuck to transfer the first substrate from the two ormore tabs of the opening of the first end of the turntable to the topsurface of the substrate chuck while the two or more tabs of the openingof the first end are positioned within the channels of the substratechuck.

Other embodiments of these aspects include corresponding systems, andapparatus configured to perform the actions of the methods.

These and other embodiments may each optionally include one or more ofthe following features. For instance, after decreasing the distancebetween the top surface of the turntable and the bottom surface of thesubstrate chuck, increasing the distance between the top surface of theturntable and the bottom surface of the substrate chuck such to i)transfer the first substrate, having a patterned formed thereon, fromthe substrate chuck to the two or more tabs of the opening of the firstend of the turntable and ii) transfer a second substrate from the two ormore pedestals to the two or more tabs of the opening of the second endof the turntable. In some examples, after increasing the distancebetween the top surface of the turntable and the bottom surface of thesubstrate chuck, rotating the turntable from the second position to thefirst position such that i) the two or more cutouts of the opening ofthe first end are in superimposition with the two or more pedestals andii) the two or more tabs of the opening of the second end of theturntable are in superimposition with the two or more channels of thesubstrate chuck. In some examples, after rotating the turntable from thesecond position to the first position, decreasing the distance betweenthe top surface of the turntable and the bottom surface of the substratechuck to i) transfer the second substrate from the two or more tabs ofthe opening of the second end of the turntable to the top surface of thesubstrate chuck while the two or more tabs of the opening of the secondend of the turntable are positioned within the channels of the substratechuck and ii) transfer the first substrate, having a patterned formedthereon, from the two or more tabs of the opening of the first end ofthe turntable to the two or more pedestals.

The features further include, for example, a plane of the firstsubstrate is maintained during the rotation of the turntable from thefirst position to the second position. In some examples, afterdecreasing the distance between the top surface of the turntable and thebottom surface of the substrate chuck, forming a pattern on the firstsubstrate. In some examples, prior rotating the turntable from the firstposition to the second position, rotating the turntable from the firstposition to a third position such that the first substrate positioned onthe two or more tabs of the opening of the first end of the turntable isin superimposition with an inspection station; and inspecting, by theinspection station and while the turntable is in the third position, thefirst substrate for one or more defects.

Innovative aspects of the subject matter described in this specificationmay be embodied in a system that includes two or more pedestals; asubstrate chuck having a top surface positioned opposite a bottomsurface, and including two or more channels; a turntable having a topsurface and a first end positioned opposite a second end, each of thefirst and second ends including a respective opening, each openingincluding two or more cutouts and two or more tabs, the turntablerotatable between first and second positions, the first position havingi) the two or more cutouts of the opening of the first end insuperposition with the two or more pedestals and ii) a first end of thetwo or more pedestals extending away from the top surface of theturntable, the second position having i) the two or more tabs of theopening of the first end of the turntable in superimposition with thetwo or more channels of the substrate chuck and ii) the two or morecutouts of the opening of the second end in superimposition with the twoor more pedestals; and an actuator system to, when the turntable is inthe first position, decrease a distance between the top surface of theturntable and the first end of two or more pedestals to transfer a firstsubstrate from the two or more pedestals to the two or more tabs of theopening of the first end of the turntable, and when the turntable is inthe second position, decrease a distance between the top surface of theturntable and the bottom surface of the substrate chuck to transfer thefirst substrate from the two or more tabs of the opening of the firstend of the turntable to the top surface of the substrate chuck while thetwo or more tabs are positioned within the channels of the substratechuck.

Other embodiments of these aspects include corresponding methodsperformed by the system.

These and other embodiments may each optionally include one or more ofthe following features. For instance, the actuator system is furtherconfigured to increase the distance the distance between the top surfaceof the turntable and the bottom surface of the substrate to i) transferthe first substrate, having a patterned formed thereon, from thesubstrate chuck to the two or more tabs of the opening of the first endof the turntable and ii) transfer the second substrate from the two ormore pedestals to the two or more tabs of the opening of the second endof the turntable. In some examples, the system includes a rotationalsystem to rotate the turntable between the first and the secondpositions. In some examples, a plane of the first substrate ismaintained while positioned on the two or more tabs of the opening ofthe first end of the turntable. In some examples, the system includes apatterning system to form a pattern in the first substrate when thefirst substrate is positioned on the top surface of the substrate chuck.In some examples, the system includes an inspection station, wherein theturntable is further rotatable to a third position such that the firstsubstrate positioned on the two or more tabs of the opening of the firstend of the turntable is in superimposition with an inspection station,the inspection station, when the turntable is in the third position,inspect the first substrate for one or more defects.

Particular implementations of the subject matter described in thisspecification can be implemented so as to realize one or more of thefollowing advantages. Implementations of the present disclosure mayimprove the transportation of substrates resulting in loweringloading/unloading times of the substrates, and increased throughput.

The details of one or more embodiments of the subject matter describedin this specification are set forth in the accompanying drawings and thedescription below. Other potential features, aspects, and advantages ofthe subject matter will become apparent from the description, thedrawings, and the claims.

DESCRIPTION OF DRAWINGS

FIG. 1 illustrates a simplified side view of a lithographic system.

FIG. 2 illustrates a simplified side view of a substrate having apatterned layer positioned thereon.

FIG. 3 illustrates a perspective view of a substrate loading system,including a turntable.

FIG. 4 illustrates a top down view of one of a portion of the turntable.

FIG. 5 illustrates a side view of a substrate chuck.

FIG. 6 illustrates a side view of the substrate loading system.

FIG. 7 illustrates a top down view of the substrate loading system.

FIGS. 8A-8H illustrate simplified side views of the substrate loadingsystem, including loading and unloading of substrates to and frompedestals and the substrate chuck.

FIG. 9 illustrates a top down view of the substrate loading system,including an inspection station.

FIG. 10 illustrates an example method for loading and unloading ofsubstrates to and from pedestals and the substrate chuck.

DETAILED DESCRIPTION

The following description is of a method and system featuring theloading and unloading of substrates, such as semiconductor wafers,involving microlithography and similar nano-fabrication techniques.Specifically, a turntable is provided having a top surface and a firstend positioned opposite a second end. In some examples, each of thefirst and second ends including a respective opening, each openingincluding two or more cutouts and two or more tabs. A substrate chuck isprovided having a top surface positioned opposite a bottom surface. Theturntable is positioned in a first position such that i) the two or morecutouts of the opening of the first end are in superimposition with twoor more pedestals and ii) a first end of the two or more pedestalsextends away from the top surface of the turntable. A distance isincreased between the top surface of the turntable and the bottomsurface of the substrate chuck to transfer a first substrate from thetwo or more pedestals to the two or more tabs of the opening of thefirst end of the turntable. The turntable is rotated from the firstposition to a second position such that i) the two or more tabs of theopening of the first end of the turntable are in superimposition withtwo or more channels of the substrate chuck and ii) the two or morecutouts of the opening of the second end are in superimposition with thetwo or more pedestals. After rotating the turntable from the firstposition to the second position, a distance is decreased between the topsurface of the turntable and the bottom surface of the substrate chuckto transfer the first substrate from the two or more tabs of the openingof the first end of the turntable to the top surface of the substratechuck while the two or more tabs of the opening of the first end arepositioned within the channels of the substrate chuck.

FIG. 1 illustrates an imprint lithography system 100 that forms a reliefpattern on a substrate 102. The substrate 102 may be coupled to asubstrate chuck 104. In some examples, the substrate chuck 104 caninclude a vacuum chuck, a pin-type chuck, a groove-type chuck, anelectromagnetic chuck, and/or the like. In some examples, the substrate102 and the substrate chuck 104 may be further positioned on an airbearing 106. The air bearing 106 provides motion about the x-, y-,and/or z-axes. In some examples, the substrate 102 and the substratechuck 104 are positioned on a stage. The air bearing 106, the substrate102, and the substrate chuck 104 may also be positioned on a base 108.In some examples, a robotic system 110 positions the substrate 102 onthe substrate chuck 104.

The substrate 102 can include a planar surface 111 positioned oppositethe substrate chuck 104. In some examples, the substrate 102 can beassociated with a thickness that is substantially uniform (constant)across the substrate 102.

The imprint lithography system 100 further includes an imprintlithography flexible template 112 that is coupled to one or more rollers114, depending on design considerations. The rollers 114 providemovement of a least a portion of the flexible template 112. Suchmovement may selectively provide different portions of the flexibletemplate 112 in superimposition with the substrate 102. In someexamples, the flexible template 112 includes a patterning surface thatincludes a plurality of features, e.g., spaced-apart recesses andprotrusions. However, in some examples, other configurations of featuresare possible. The patterning surface may define any original patternthat forms the basis of a pattern to be formed on substrate 102. In someexamples, the flexible template 112 may be coupled to a template chuck,e.g., a vacuum chuck, a pin-type chuck, a groove-type chuck, anelectromagnetic chuck, and/or the like.

The imprint lithography system 100 may further comprise a fluid dispensesystem 120. The fluid dispense system 120 may be used to deposit apolymerizable material on the substrate 102. The polymerizable materialmay be positioned upon the substrate 102 using techniques such as dropdispense, spin-coating, dip coating, chemical vapor deposition (CVD),physical vapor deposition (PVD), thin film deposition, thick filmdeposition, and/or the like. In some examples, the polymerizablematerial is positioned upon the substrate 102 as a plurality ofdroplets.

Referring to FIGS. 1 and 2, the imprint lithography system 100 mayfurther comprise an energy source 122 coupled to direct energy towardsthe substrate 102. In some examples, the rollers 114 and the air bearing106 are configured to position a desired portion of the flexibletemplate 112 and the substrate 102 in a desired positioning. The imprintlithography system 100 may be regulated by a processor in communicationwith the air bearing 106, the rollers 114, the fluid dispense system120, and/or the energy source 122, and may operate on a computerreadable program stored in a memory.

In some examples, the rollers 114, the air bearing 106, or both, vary adistance between the flexible template 112 and the substrate 102 todefine a desired volume therebetween that is filled by the polymerizablematerial. For example, the flexible template 112 contacts thepolymerizable material. After the desired volume is filled by thepolymerizable material, the energy source 122 produces energy, e.g.,broadband ultraviolet radiation, causing the polymerizable material tosolidify and/or cross-link conforming to shape of a surface of thesubstrate 102 and a portion of the patterning surface of the flexibletemplate 122, defining a patterned layer 150 on the substrate 102. Insome examples, the patterned layer 150 may comprise a residual layer 152and a plurality of features shown as protrusions 154 and recessions 156.

FIG. 3 illustrates a perspective view of a substrate loading system 302.In short, the substrate loading system 302 facilitates loading andunloading of substrates to and from one or more stations (e.g.,pedestals and/or substrate chucks). The substrate loading system 302includes a turntable 304 having a top surface 306 and a first end 308positioned opposite a second end 310. The first end 308 includesopenings 312 a, 312 b (collectively referred to as openings 312); andthe second end 310 includes openings 314 a, 314 b (collectively referredto as openings 314). However, the first end 308 and the second end 310including any number of openings 314 and 316, respectively. Each of theopenings 312, 314, include cutouts and tabs. Specifically, FIG. 4illustrates a top down view of one of the openings 312, 314, thatincludes cutouts 316 a, 316 b, 316 c, 316 d (collectively referred to ascutouts 316) and tabs 318 a, 318 b, 318 c, 318 d (collectively referredto as tabs 318). However, each of the openings 312, 314 can include anynumber of cutouts 316 and tabs 318.

The substrate loading system 302 further includes substrate chucks 320a, 320 b, 320 c, 320 d (collectively referred to as substrate chucks320); however, the system 302 can include any number of substrate chucks320. FIG. 5 illustrates a side view of one of the substrate chucks 320.The substrate chuck 320 includes a top surface 322 positioned opposite abottom surface 324. The substrate chuck 320 also includes channels 326positioned at a perimeter of each substrate chuck 320. In some examples,for a particular opening 312, 314, the quantity of the channels 326matches the quantity of the tabs 318 of the particular opening 312, 314.The substrate loading system 302 further includes a pedestal platform330 that includes a plurality of pedestals 332. In some examples, afirst subset of the pedestals 332 can be associated with a first height,and a second subset of the pedestals 332 can be associated with a secondheight.

Referring to FIG. 6, a side view of the substrate loading system 302 isshown. The substrate loading system 302 further includes an actuatorsystem 340 and a rotational system 342. The actuator system 340increases and/or decreases a relative positioning of the turntable 304with respect to the substrate chucks 320 and the pedestals 332. Therotational system 342 rotates the turntable 304 with respect to an axis344. The substrate loading system 302 further includes an air bearing350 and a support structure 352. In some examples, the air bearing 350facilitates movement of the substrate chucks 320 about the supportstructure 352. Referring to FIG. 7, a top down view of the substrateloading system 302 is shown. The substrate loading system 302 furtherincludes an inspection station 346 that inspects substrates for one ormore defects.

Referring to FIGS. 8A-8H, the substrate loading system 302 is shownfacilitating loading and unloading of substrates to and from thepedestals 332 and the substrate chucks 320. Specifically, in someimplementations, as shown in FIG. 8A, the rotational system 342positions the turntable 304 to be in a first position. Specifically, therotational system 342 rotates the turntable 304 about the axis 344 suchthat the turntable is in the first position. In some examples,positioning the turntable 304 in the first position by the rotationalsystem 342 includes having the cutouts 316 of each of the openings 312of the first end 308 in superimposition with the pedestals 332. In someexamples, positioning the turntable 304 in the first position by therotational system 342 includes having a first end 354 of each of thepedestals 332 extend away from the top surface 306 of the turntable 304.

In some implementations, as shown in FIG. 8B, the actuator system 340increases a distance between the top surface 306 of the turntable 304and the bottom surface 324 of the substrate chuck 320. That is, theactuator system 340 translates along a direction away from the supportstructure 352. In some examples, increasing the distance between the topsurface 306 of the turntable 304 and bottom surface 324 of the substratechuck 320 includes transferring a first substrate 360 from beingpositioned on the pedestals 332 to the tabs 318 of the opening 312 ofthe first end 308 of the turntable 304.

In some examples, by transferring the first substrate 360 to the tabs318 of the opening 312 of the first end 308 of the turntable 304,contact with the first substrate 360 is minimized. That is, bycontacting the first substrate 360 with only by the tabs 318 of theturntable 304, contact between such is minimized. By minimizing contactwith the first substrate 360, e.g., by the tabs 318, introduction ofpossible defects to the first substrate 360 are minimized, as well as,minimizing particle contamination of the first substrate 360 by theturntable 304.

In some implementations, as shown in FIG. 8C, the rotational system 342rotates the turntable 304 from the first position to a second position.Specifically, the rotational system 342 rotates the turntable 304 aboutthe axis 344 such that the turntable 304 is in the second position. Insome examples, positioning the turntable 304 in the second positionincludes having the tabs 318 of the opening 312 of the first end 308 ofthe turntable 304 in superimposition with the channels 326 of thesubstrate chuck 320. In some examples, positioning the turntable 304 inthe second position includes having the cutouts 316 of the opening 314of the second end 310 of the turntable 304 in superimposition with thepedestals 332.

In some examples, a plane of the first substrate 360 is maintainedduring rotation of the turntable 304 from the first position to thesecond position. Specifically, as shown in FIG. 8B, the first substrate360 lays about a plane 380. To that end, during rotation of theturntable 304 from the first positon to the second position, the plane380 of the first substrate 360 is maintained, as shown in FIG. 8C. Insome examples, maintaining the plane 380 of the first substrate 360includes minimizing, if not preventing, undesirable angular movement ofthe first substrate 360 (e.g., with respect to the plane 380). In someexamples, the plane 380 of the first substrate 360 is maintainedthroughout any or all portions of loading and unloading of the firstsubstrate 360 to and from the pedestals 332 and the substrate chuck 320.

In some implementations, as shown in FIG. 8D, after the rotationalsystem 342 rotates the turntable 304 from the first position to thesecond position, the actuator system 340 decreases a distance betweenthe top surface 306 of the turntable 304 and the bottom surface 324 ofthe substrate chuck 320. That is, the actuator system 340 translatesalong a direction towards the support structure 352. In some examples,decreasing the distance between the top surface 306 of the turntable 304and the bottom surface 324 of the substrate chuck 320 includestransferring the substrate 360 from the tabs 318 of the opening 312 ofthe first end 308 of the turntable 304 to the top surface 322 of thesubstrate chuck 320 while the tabs 318 of the opening 312 of the firstend 308 of the turntable 304 are positioned within the channels 326 ofthe substrate chuck 320.

In some implementations, as shown in FIG. 8E, after decreasing thedistance between the top surface 306 of the turntable 304 and the bottomsurface 324 of the substrate chuck 320, a patterning system, e.g., asshown in FIG. 1, forms a pattern in (or in a layer positioned on) thefirst substrate 360. Specifically, the air bearing 350 facilitatesmovement of the substrate chuck 320 about the support structure 352 in adirection away from the turntable 320 and towards the patterning system(not shown). In some examples, concurrently with forming a pattern inthe first substrate 360 (or concurrently with a portion of the processof forming a pattern in the first substrate 360), a robotic system (notshown) positions a second substrate 372 on the pedestals 332.

In some implementations, as shown in FIG. 8F, after decreasing thedistance between the top surface 306 of the turntable 304 and the bottomsurface 324 of the substrate chuck 320, the actuator system 340increases the distance between the top surface 306 of the turntable 304and the bottom surface 324 of the substrate chuck 320. That is, theactuator system 340 translates along a direction away from the supportstructure 352. In some examples, the actuator system 340 increases thedistance between the top surface 306 of the turntable 304 and the bottomsurface 324 of the substrate 320 after forming a pattern in the firstsubstrate 360, as described with respect to FIG. 8E; that is, after theair bearing 350 facilitates movement of the substrate chuck 320 aboutthe support structure 352 in a direction towards the turntable 320 andaway from the patterning system (not shown).

In some examples, increasing the distance between the top surface 306 ofthe turntable 304 and the bottom surface 324 of the substrate chuck 320includes transferring the first substrate 360, having the pattern 370formed thereon, from the substrate chuck 320 to the tabs 318 of theopening 312 of the first end 308 of the turntable 304. In some examples,increasing the distance between the top surface 306 of the turntable 304and the bottom surface 324 of the substrate chuck 320 includestransferring the second substrate 372 from the pedestals 332 to the tabs318 of the opening 314 of the second end 310 of the turntable 304.

In some implementations, as shown in FIG. 8G, after increasing thedistance between the top surface 306 of the turntable 304 and the bottomsurface 324 of the substrate chuck 320, the rotational system 342rotates the turntable 304 from the second position to the firstposition. Specifically, the rotational system 342 rotates the turntable304 about the axis 344 such that the turntable 304 is in the firstposition. In some examples, positioning the turntable in the firstposition includes having the cutouts 316 of the opening 312 of the firstend 308 of the turntable 304 in superimposition with the pedestals 332.In some examples, positioning the turntable 304 in the first positionincludes having the tabs 318 of the second end 310 of the turntable 304in superimposition with the channels 326 of the substrate chuck 320.

In some implementations, as shown in FIG. 8H, after rotating theturntable from the second position to the first position, the actuatorsystem 340 decreases the distance between the between the top surface306 of the turntable 304 and the bottom surface 324 of the substratechuck 320. That is, the actuator system 340 translates along a directiontowards from the support structure 352. In some examples, decreasing thedistance between the between the top surface 306 of the turntable 304and the bottom surface 324 of the substrate chuck 320 includestransferring the second substrate 372 from the tabs 318 of the secondend 310 of the turntable 304 to the top surface 322 of the substratechuck 320 while the tabs 318 of the opening 314 of the second end 310 ofthe turntable 304 are positioned within the channels 326 of thesubstrate chuck 320. In some examples, decreasing the distance betweenthe between the top surface 306 of the turntable 304 and the bottomsurface 324 of the substrate chuck 320 includes transferring the firstsubstrate 360, having the patterned 370 formed thereon, from the tabs318 of the opening 312 of the first end 308 of the turntable 304 to thepedestals 332.

In some examples, the second substrate 372 can be processed similar tothat described above with respect to the first substrate 360, andspecifically, that the process described in FIGS. 8A-8H can be appliedto the second substrate 372. In some examples, any of the steps of FIGS.8A-8H can happen serially, or in parallel.

For simplicity of illustration, a single first substrate 360, a singlesecond substrate 372, and a single substrate chuck 320 are shown;however the process of FIGS. 8A-8H can be applied to a plurality offirst substrates 360 and plurality of second substrates 372 with respectto a plurality of substrate chucks 320. That is, a plurality of firstsubstrates 360 and a plurality of second substrates 372 can be subjectto the process of FIGS. 8A-8H, concurrently.

In some implementations, as shown in FIG. 9, prior to the rotationalsystem 342 rotating the turntable 304 from the first position to thesecond position, the rotational system 342 rotates the turntable 304from the first position to a third position. Specifically, therotational system 342 rotates the turntable 304 about the axis 344 suchthat the turntable 304 is in a third position. In some examples,positioning the turntable 304 in the third position includes having thetabs of the opening 312 of the first end 308 of the turntable 304 insuperimposition with the inspection station 346. In some examples, whenthe turntable is positioned in the third position, the inspectionstation 346 inspects the first substrate 360 for one or more defects.

In some implementations, the rotational system 342 rotates the turntable304 to a fourth position. Specifically, the rotational system 342rotates the turntable 304 about the axis 344 such that the turntable 304is in the fourth position. In some examples, the fourth positionincludes having the opening 312 of the first end 308 of the turntable304 in superimposition with a deposition station (not shown).Specifically, in some examples, the rotational system 342 rotates theturntable 304 to the fourth position after forming the patterned layer370 on the first substrate 360, that is, the first substrate 360 insuperimposition with the deposition station. The deposition station caninclude an inkjet fluid dispensing system that dispense a reflectivematerial layer on the patterned layer 370. In some examples, thereflective material layer can include aluminum and/or silver.

In some examples, the first end 308 of the turntable 304 can bepositioned in superimposition with the deposition station concurrentlywith the second end 310 of the turntable 304 in superimposition with theinspection station 346. In some examples, the first end 308 of theturntable 304 can be positioned in superimposition with the depositionstation concurrently with the second end 310 of the turntable 304 insuperimposition with the pedestals 332; or in superimposition with thesubstrate chuck 320.

FIG. 10 illustrates an example method for loading and unloading ofsubstrates to and from pedestals and the substrate chuck. The process1000 is illustrated as a collection of referenced acts arranged in alogical flow graph. The order in which the acts are described is notintended to be construed as a limitation, and any number of thedescribed acts can be combined in other orders and/or in parallel toimplement the process.

Turntable 304 is provided having the top surface 306 and the first end308 positioned opposite the second end 310 (1002). In some examples,each of the first end 308 and second end 310 include a respectiveopening 312, 314. In some examples, each opening 312, 314 includes twoor more cutouts 316 and two or more tabs 318. The substrate chuck 320 isprovided having the top surface 322 positioned opposite the bottomsurface 332 (1004). The turntable 304 is positioned in a first position(1006). For example, the rotational system 342 rotates the turntable 304to the first position. In some examples, positioning the turntable 304in the first position includes i) the two or more cutouts 316 of theopening 312 of the first end 308 in superimposition with two or morepedestals 332 and ii) the first end 354 of the two or more pedestals 332extending away from the top surface 306 of the turntable 304.

A distance between the top surface 306 of the turntable 304 and thebottom surface 332 of the substrate chuck 320 is increased (1008). Forexample, the actuator system 340 increases the distance between the topsurface 306 of the turntable 304 and the bottom surface 332 of thesubstrate chuck 320. In some examples, the distance between the topsurface 306 of the turntable 304 and the bottom surface 332 of thesubstrate chuck 320 is increased to transfer the first substrate 360from the pedestals 332 to the tabs 318 of the opening 312 of the firstend 308 of the turntable 306.

The turntable 304 is rotated from the first position to the secondposition (1010). For example, the rotational system 342 rotates theturntable 304 from the first position to the second position. In someexamples, rotating the turntable 304 from the first position includes i)the tabs 318 of the opening 312 of the first end 308 of the turntable306 in superimposition with channels 326 of the substrate chuck 320 andii) the cutouts 316 of the opening 314 of the second end 310 are insuperimposition with the pedestals 332.

After rotating the turntable 304 from the first position to the secondposition, a distance between the top surface 306 of the turntable 304and the bottom surface 3323 of the substrate chuck 320 is decreased(1012). For example, the actuator system 340 decreases the distancebetween the top surface 306 of the turntable 304 and the bottom surface332 of the substrate chuck. In some examples, the distance between thetop surface 306 of the turntable 304 and the bottom surface 3323 of thesubstrate chuck 320 is decreased to transfer the first substrate 360from the tabs 318 of the opening 312 of the first end 308 of theturntable 304 to the top surface 322 of the substrate chuck 320 whilethe tabs 318 of the opening 312 of the first end 308 are positionedwithin the channels 326 of the substrate chuck 320.

1. An imprint lithography method, comprising: providing a turntablecomprising a top surface and a first end positioned opposite a secondend, each of the first and second ends including a respective opening,each opening including two or more cutouts and two or more tabs;providing a substrate chuck comprising a top surface positioned oppositea bottom surface; positioning the turntable in a first position suchthat i) the two or more cutouts of the opening of the first end are insuperimposition with two or more pedestals and ii) a first end of thetwo or more pedestals extends away from the top surface of theturntable; increasing a distance between the top surface of theturntable and the bottom surface of the substrate chuck to transfer afirst substrate from the two or more pedestals to the two or more tabsof the opening of the first end of the turntable; rotating the turntablefrom the first position to a second position such that i) the two ormore tabs of the opening of the first end of the turntable are insuperimposition with two or more channels of the substrate chuck and ii)the two or more cutouts of the opening of the second end are insuperimposition with the two or more pedestals; and after rotating theturntable from the first position to the second position, decreasing adistance between the top surface of the turntable and the bottom surfaceof the substrate chuck to transfer the first substrate from the two ormore tabs of the opening of the first end of the turntable to the topsurface of the substrate chuck while the two or more tabs of the openingof the first end are positioned within the channels of the substratechuck.
 2. The imprint lithography method of claim 1, further comprising:after decreasing the distance between the top surface of the turntableand the bottom surface of the substrate chuck, increasing the distancebetween the top surface of the turntable and the bottom surface of thesubstrate chuck such to i) transfer the first substrate, having apatterned formed thereon, from the substrate chuck to the two or moretabs of the opening of the first end of the turntable and ii) transfer asecond substrate from the two or more pedestals to the two or more tabsof the opening of the second end of the turntable.
 3. The imprintlithography method of claim 2, further comprising: after increasing thedistance between the top surface of the turntable and the bottom surfaceof the substrate chuck, rotating the turntable from the second positionto the first position such that i) the two or more cutouts of theopening of the first end are in superimposition with the two or morepedestals and ii) the two or more tabs of the opening of the second endof the turntable are in superimposition with the two or more channels ofthe substrate chuck.
 4. The imprint lithography method of claim 3,further comprising: after rotating the turntable from the secondposition to the first position, decreasing the distance between the topsurface of the turntable and the bottom surface of the substrate chuckto i) transfer the second substrate from the two or more tabs of theopening of the second end of the turntable to the top surface of thesubstrate chuck while the two or more tabs of the opening of the secondend of the turntable are positioned within the channels of the substratechuck and ii) transfer the first substrate, having a patterned formedthereon, from the two or more tabs of the opening of the first end ofthe turntable to the two or more pedestals.
 5. The imprint lithographymethod of claim 1, wherein a plane of the first substrate is maintainedduring the rotation of the turntable from the first position to thesecond position.
 6. The imprint lithography method of claim 1, afterdecreasing the distance between the top surface of the turntable and thebottom surface of the substrate chuck, forming a pattern on the firstsubstrate.
 7. The imprint lithography method of claim 1, furthercomprising: prior rotating the turntable from the first position to thesecond position, rotating the turntable from the first position to athird position such that the first substrate positioned on the two ormore tabs of the opening of the first end of the turntable is insuperimposition with an inspection station; and inspecting, by theinspection station and while the turntable is in the third position, thefirst substrate for one or more defects.
 8. An imprint lithographysystem, comprising: two or more pedestals; a substrate chuck having atop surface positioned opposite a bottom surface, and including two ormore channels; a turntable having a top surface and a first endpositioned opposite a second end, each of the first and second endsincluding a respective opening, each opening including two or morecutouts and two or more tabs, the turntable rotatable between first andsecond positions, the first position having i) the two or more cutoutsof the opening of the first end in superposition with the two or morepedestals and ii) a first end of the two or more pedestals extendingaway from the top surface of the turntable, the second position havingi) the two or more tabs of the opening of the first end of the turntablein superimposition with the two or more channels of the substrate chuckand ii) the two or more cutouts of the opening of the second end insuperimposition with the two or more pedestals; and an actuator systemto, when the turntable is in the first position, decrease a distancebetween the top surface of the turntable and the first end of two ormore pedestals to transfer a first substrate from the two or morepedestals to the two or more tabs of the opening of the first end of theturntable, and when the turntable is in the second position, decrease adistance between the top surface of the turntable and the bottom surfaceof the substrate chuck to transfer the first substrate from the two ormore tabs of the opening of the first end of the turntable to the topsurface of the substrate chuck while the two or more tabs are positionedwithin the channels of the substrate chuck.
 9. The imprint lithographysystem of claim 8, the actuator system further configured to increasethe distance the distance between the top surface of the turntable andthe bottom surface of the substrate to i) transfer the first substrate,having a patterned formed thereon, from the substrate chuck to the twoor more tabs of the opening of the first end of the turntable and ii)transfer the second substrate from the two or more pedestals to the twoor more tabs of the opening of the second end of the turntable.
 10. Theimprint lithography system of claim 8, further comprising a rotationalsystem to rotate the turntable between the first and the secondpositions.
 11. The imprint lithography system of claim 8, wherein aplane of the first substrate is maintained while positioned on the twoor more tabs of the opening of the first end of the turntable.
 12. Theimprint lithography system of claim 8, further comprising a patterningsystem to form a pattern in the first substrate when the first substrateis positioned on the top surface of the substrate chuck.
 13. The imprintlithography system of claim 8, further comprising an inspection station,wherein the turntable is further rotatable to a third position such thatthe first substrate positioned on the two or more tabs of the opening ofthe first end of the turntable is in superimposition with an inspectionstation, the inspection station, when the turntable is in the thirdposition, inspect the first substrate for one or more defects.